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Polishing Compound

Mipox Abrasives offers Polishing Compound for its longer life, high performance and smooth finishes. Since the inception of our company, we are engaged in the manufacture, supply and export of the fin Read more

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Anti Scale Compound

Steel Plant Specialities offers Anti Scale Compound. ESPON-SR, Anti Scale Compound is used for coating hot forged, hot rolled or cast components before charging them into furnace for heat treatment Read more

Anti Scale Compound

Steel Plant Specialities offers Anti Scale Compound, ESPON-HF. ESPON-HF, Anti Scale Compound is used for coating hot forged, hot rolled or cast components before charging them into furnace for heat tr Read more

Anti Scale Compound

Steel Plant Specialities offers Anti Scale Compound, ESPON-HR. ESPON-HR, Anti Scale Compound is used for coating the billets or blooms before charging them into the re-heating furnace for hot rolling. Read more

Polishing Compound, XCut

Mipox Abrasives India Pvt Ltd offers Polishing Compound, XCut. Features: XCut, a auto rubbing compound is used for removing minor surface paint scratches, swirl marks, oxidation and brightening colour Read more

Black Epoxy Encapsulating and Potting Compound

Black Epoxy Encapsulating and Potting Compound protects sensitive electronic components from impact, shock, vibration, heat, conductivity, moisture, chemicals, and visual inspection. Read more

Translucent Epoxy Encapsulating and Potting Compound

Translucent Epoxy Encapsulating and Potting Compound protects sensitive electronic components from impact, shock, vibration, heat, conductivity, moisture, chemicals. Allows visual inspection. Read more

Thermally Conductive Epoxy Encapsulating & Potting Compound

The Thermally Conductive Epoxy Encapsulating & Potting Compound is 100% solids. This compound is formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity Read more

High Temperature Epoxy Encapsulating and Potting Compound

The High Temperature Epoxy Encapsulating and Potting Compound is used for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved te Read more

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